Stick-slips of peeling adhesive tapes: not just high-speed
byXiaole Li, Helen Bristow, Ahmed A. Said, Farrukh Kamoliddinov, Sigurdur T. Thoroddsen, Gilles Lubineau
ArticleYear:2025
Abstract
Peeling an adhesive tape exhibits dynamic stick-slip instabilities, which are typically observed
within a specific range of peel speeds. We demonstrate that this stick-slip instability arises
from the viscoelastic dynamics of discrete fibrils formed during adhesive deformation and that
a transition occurs from strength-governed to energy-governed fracture throughout the stickslip process. By systematically tuning the adhesives/substrate detaching response, we show
that the stick-slip instability can occur even at very low peel speeds, a phenomenon previously
thought to be restricted to higher speeds. This work provides a deeper understanding of the
physics behind stick-slip behavior in peeling, offering potential strategies for mitigating this
instability in practical applications.
Keywords
Stick-slippeel testAdhesive fibrillationDelamination of thin-film devices